Corsair 4GB (2x2GB) DDR3 CMP4GX3M2A1600C8 1600MHz Dual Channel Kit - CMP4GX3M2A1600C8
12 In Stock
* Ships in 1-3 days *- Overclock Code: CMP4GX3M2A1600C8
- Corsair Product Code: CMP4GX3M2A1600C8
- Brand: Corsair
Corsair 4GB (2x2GB) 1600MHz CMP4GX3M2A1600C8 DDR3 Dual Channel Kit - Corsair's Dominator® DDR3 memory represents the ultimate in performance technology engineering. Dominator was designed to have the highest performing IC's, maximum over-clocking capability, and efficient DHX cooling—all while being stable and reliable.
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Very few components make it into the Dominator family of DDR2 and DDR3 memory. Corsair performs rigorous testing and screening on all components to select only the best for Dominator memory modules. The tests check for high frequency and/or low latency capabilities for each IC. Then, they are thoroughly tested for maximum interoperability and reliability as a united group to meet the stringent design criteria demanded by performance computing and gaming users.
Specifications
Speed Rating: PC3-12800
Tested Speed: 1600Mhz
Size: 4GB Kit (2 x 2GB)
Tested Latency: 8-8-8-24
Tested Voltage: 1.65
Performance Profile: XMP
SPD Speed: 1333Mhz
SPD Latency: 8-8-8-24
Package: 240pin DIMM
Fan Included: No
Heat is the enemy of your computer’s key components.
The more you tweak components for performance, the more heat is generated. Heat will slow down your system and impact long term reliability. With traditional DDR2 memory, the standard method of chip packaging involves a BGA (Ball Grid Array). In a BGA, small balls of solder, organized as a grid, are the leads that connect the device to the module circuit board. A Micron Semiconductor study shows that in a BGA memory device as much as 50% of the heat generated by the chip is actually conducted into the circuit board. Since traditional heat sinks are only attached to the front surface of memory chips, there’s no easy thermal path for the heat coming from the back of the chips.
Corsair’s Unique Dual-path Heat Xchange (DHX) Solves the Problem
Corsair’s engineers have developed a unique technology that maximizes heat dissipation while improving reliability, even in the most extremely overclocked memory module. Dual-Path Heat Exchange (DHX) technology utilizes two methods to effectively remove heat from the memory circuit board—Convection and Conduction.
Optional AirFlow—Extra Cooling for Extreme Overclocking
The optional Airflow fan unit contains three 40mm tachometer-controlled fans to provide impinging airflow to the memory subsystem. With the moderate RPMs required to provide adequate forced air, the Airflow fan is nearly silent. The fan easily clamps onto most motherboards.
Dominator—Setting the New Standard
Dominator is the industry’s performance and award leader. It has won numerous honors to date including various Editor’s Choice awards and several “Memory of the Year” honors. -
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